![]() ![]() The image below shows where these three quantities fit into a component footprint. The IPC-7351 standard specifies some important dimensions for creating a PCB land pattern for a SOIC footprint these are the pad width (X), pad spacing (G), and end-to-end pad dimension (Z). Here’s what you need to know about designing a PCB land pattern to comply with the IPC-7351 standard, and how your design tools can help. These standards are intended to accommodate component spacing and tolerances on component dimensions, preventing common SMD solder defects like bridging during assembly. You’re not going to get in trouble simply because you didn’t design your pads to comply with the IPC-7351 standard, but it is good to follow standards on land patterns. ![]() This important standard provides requirements for SMD pad dimensions in PCB footprints. ![]() However, many designers opt for land patterns designed according to the IPC-7351 standard. One common question from new designers is: what should the pad dimensions be? Technically, the only constraints on a PCB land pattern are those imposed by fabricator DFM requirements. Your components won’t attach to your PCB without land patterns, and it’s up to the designer to create compliant land patterns for components. ![]()
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